两个来自非脱羧勒克菌的MDR质粒耐药机制研究(一)

2025-08-18

三星电子设备解决方案DS)部门已着手开发下一代封装材料“玻璃中介层”,目标不仅是取代昂贵的硅中介层,还要提升芯片性能。据报导,三星电子最近收到澳洲材料商Chemtronics和南韩设备商Philopt

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摄影:蔡海珊
作者/通讯员:蔡海珊 | 来源:商贸流通研究院 | 编辑:伍一龙